Invention Grant
- Patent Title: Laminated ceramic electronic component
- Patent Title (中): 层压陶瓷电子元件
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Application No.: US13936402Application Date: 2013-07-08
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Publication No.: US09455086B2Publication Date: 2016-09-27
- Inventor: Yasuyuki Shimada , Takashi Sawada
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2012-165438 20120726
- Main IPC: H01G4/005
- IPC: H01G4/005 ; H01G4/30 ; H01G4/232

Abstract:
In a laminated ceramic electronic component, a side-surface outer electrode includes a first electrode portion including side-surface electrode portions located on first and second side surfaces and wrap-around electrode portions arranged to extend around from the side-surface electrode portions of the first electrode portion to portions of third and fourth side surfaces; and a second electrode portion including side-surface electrode portions located on the third and fourth side surfaces and wrap-around electrode portions arranged to extend around from the side-surface electrode portions of the second electrode portion to portions of the first and second side surfaces. The wrap-around electrode portions of the second electrode portion reach regions covering portions of outermost inner electrodes located at an outermost side portion among inner electrodes, which portions are exposed in the first and second side surfaces.
Public/Granted literature
- US20140029159A1 LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2014-01-30
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