发明授权
- 专利标题: Buffer material for packing wafer carrier
- 专利标题(中): 用于包装晶片载体的缓冲材料
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申请号: US13943249申请日: 2013-07-16
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公开(公告)号: US09455168B2公开(公告)日: 2016-09-27
- 发明人: Tomohiro Horio
- 申请人: SUMCO CORPORATION
- 申请人地址: JP Tokyo
- 专利权人: SUMCO CORPORATION
- 当前专利权人: SUMCO CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Greenblum & Bernstein, P.L.C.
- 优先权: JP2013-026265 20130214
- 主分类号: B65D81/02
- IPC分类号: B65D81/02 ; H01L21/673
摘要:
At the time of packing a wafer carrier into a container, an upper buffer body and a lower buffer body are arranged above and below the wafer carrier. The wafer carrier has: a box-like carrier main body having a frame-like step portion formed on an upper inner peripheral surface of an access opening; and a lid body that closes the access opening in an openable manner when it is accommodated in the frame-like step portion through a gasket. Further, the upper buffer body has: an upper concave portion that accommodates an upper portion of the wafer carrier therein; and a pressing rib that is brought into contact with an upper end surface of a carrier main body and pressed against the upper end surface of the carrier main body without contacting with the lid body. Furthermore, the lower buffer body has: a lower concave portion and a support portion.
公开/授权文献
- US20140227469A1 BUFFER MATERIAL FOR PACKING WAFER CARRIER 公开/授权日:2014-08-14
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