发明授权
US09455168B2 Buffer material for packing wafer carrier 有权
用于包装晶片载体的缓冲材料

Buffer material for packing wafer carrier
摘要:
At the time of packing a wafer carrier into a container, an upper buffer body and a lower buffer body are arranged above and below the wafer carrier. The wafer carrier has: a box-like carrier main body having a frame-like step portion formed on an upper inner peripheral surface of an access opening; and a lid body that closes the access opening in an openable manner when it is accommodated in the frame-like step portion through a gasket. Further, the upper buffer body has: an upper concave portion that accommodates an upper portion of the wafer carrier therein; and a pressing rib that is brought into contact with an upper end surface of a carrier main body and pressed against the upper end surface of the carrier main body without contacting with the lid body. Furthermore, the lower buffer body has: a lower concave portion and a support portion.
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