Invention Grant
- Patent Title: Circuit module and production method therefor
- Patent Title (中): 电路模块及其制作方法
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Application No.: US14148240Application Date: 2014-01-06
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Publication No.: US09455209B2Publication Date: 2016-09-27
- Inventor: Eiji Mugiya , Masaya Shimamura , Kenzo Kitazaki , Takehiko Kai
- Applicant: Taiyo Yuden Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: JP2013-076887 20130402
- Main IPC: H01L23/28
- IPC: H01L23/28 ; H05K3/28 ; H01L23/552 ; H01L21/56 ; H01L23/00 ; H05K1/02 ; H05K1/09 ; H05K3/00
Abstract:
A circuit module includes: a wiring substrate including a mounting surface having first and second areas and a terminal surface on the other side of the mounting surface; a plurality of electronic components mounted on the first and second areas; a sealing layer that covers the plurality of electronic components, is formed of an insulation material, and includes a groove portion formed along a boundary between the first and second areas; a conductive shield including a first shield portion that covers an outer surface of the sealing layer and a second shield portion provided in the groove portion; and a conductive layer including a wiring portion that is provided on the mounting surface and electrically connects the terminal surface and the second shield portion, and a thickening portion that is provided in the wiring portion and partially thickens a connection area of the wiring portion with the second shield portion.
Public/Granted literature
- US20140293550A1 CIRCUIT MODULE AND PRODUCTION METHOD THEREFOR Public/Granted day:2014-10-02
Information query
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