Techniques for forming high-bandwidth proximity connection between capacitively coupled plug and receptacle are described herein. A system for achieving capacitive coupling between contactless pads is described. The techniques include aligning and retaining the plug and receptacle in close proximity to one another. The techniques include cancelling crosstalk in the system based on the symmetry and orientation of differential pairs comprising signal pads. The techniques include enabling a high-bandwidth proximity transmission by filtering the transmission using a silicon buffer component.