An electrical connector includes a plurality of contact modules stacked parallel to each other within a housing. Each contact module includes a pair of wafer sub-assemblies. The wafer sub-assemblies are identical and oriented 180° with respect to each other. Each wafer sub-assembly includes an overmolded leadframe and a conductive shell holding the overmolded leadframe. The overmolded leadframe has a plurality of contacts including intermediate sections extending between mating and mounting ends. The intermediate sections are encased in an overmolded body of the overmolded leadframe. The shell has a pocket at an inner side thereof receiving the overmolded leadframe and the inner sides of the shells face each other. The shell has securing features for securing the shells together and the shell provides electrical shielding for the contacts of the overmolded leadframe.