Invention Grant
- Patent Title: Encapsulation for link layer preemption
- Patent Title (中): 封装链路层抢占
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Application No.: US14187098Application Date: 2014-02-21
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Publication No.: US09455905B2Publication Date: 2016-09-27
- Inventor: Patricia Ann Thaler , Eric John Spada
- Applicant: Broadcom Corporation
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Brinks Gilson & Lione
- Main IPC: H04L12/725
- IPC: H04L12/725 ; H04L1/00 ; H04L12/703 ; H04L12/771

Abstract:
Devices implement encapsulation to support link layer preemption. The device may include a encapsulation logic that encapsulates data, such as an Ethernet frame, to produce an encapsulated frame. The encapsulated frame may include an encapsulation element that indicates whether the encapsulated data includes non-preemptible data, such as Distinguished Minimum Latency Traffic (DMLT), or preemptible data. The encapsulated frame may also indicate whether the encapsulated data comprises the last fragment of a preemptible frame.
Public/Granted literature
- US20140245114A1 ENCAPSULATION FOR LINK LAYER PREEMPTION Public/Granted day:2014-08-28
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