Invention Grant
- Patent Title: Pad conditioning tool
- Patent Title (中): 垫调节工具
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Application No.: US14187048Application Date: 2014-02-21
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Publication No.: US09457450B2Publication Date: 2016-10-04
- Inventor: Jun-Wen Chung , Tzu-Hsuan Dai , Wen-Yen Shen , Kuang-Ling Wei , Chuan-Lang Lu
- Applicant: TERA XTAL TECHNOLOGY CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: TERA XTAL TECHNOLOGY CORPORATION
- Current Assignee: TERA XTAL TECHNOLOGY CORPORATION
- Current Assignee Address: TW Hsinchu
- Agent Mark M. Friedman
- Priority: TW102204264U 20130308; TW102110497A 20130325; TW102112375A 20130408
- Main IPC: B24B53/017
- IPC: B24B53/017 ; B24D18/00 ; B24B53/053 ; B24B53/02
Abstract:
A pad conditioning tool includes a sapphire chip having a side surface defining a polishing surface and a plurality of sapphire grains formed on the polishing surface in an integral manner. Each of the sapphire grains had a three-dimensional geometric structure. The sapphire grains are arranged on the polishing surface in a specific form so as to possess a specific pattern.
Public/Granted literature
- US20140256236A1 PAD CONDITIONING TOOL AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-09-11
Information query
