The present invention provides a barrier laminate with enhanced heat resistance performance, comprising at least one organic layer and at least one inorganic barrier layer, the organic layer being formed by curing a polymerizable composition comprising a polymerizable compound having two or more polymerizable groups, and the total quantity of uncured component in the organic layer being 1.5 weight % or less of the total weight of the organic layer, and a novel polymerizable compound that can preferably used as the polymerizable compound, which is denoted by general formula (11): in general formula (11), R21 denotes hydrogen atom or methyl group; R22 denotes methyl group or cyclohexyl group; n denotes an integer of 0 to 2; and each instance of X denotes a group comprising a polymerizable group.