Invention Grant
- Patent Title: Conductive structure and method for manufacturing same
- Patent Title (中): 导电结构及其制造方法
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Application No.: US14424321Application Date: 2013-08-30
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Publication No.: US09462682B2Publication Date: 2016-10-04
- Inventor: Jin Hyong Lim , Sujin Kim , Ki-Hwan Kim
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: Dentons US LLP
- Priority: KR10-2012-0096493 20120831
- International Application: PCT/KR2013/007858 WO 20130830
- International Announcement: WO2014/035197 WO 20140306
- Main IPC: G06F3/045
- IPC: G06F3/045 ; H05K1/02 ; G06F3/041 ; G06F3/044 ; C23C14/34 ; G06F1/16 ; H05K1/09 ; H05K3/06 ; H05K3/16 ; H05K3/46

Abstract:
The disclosure provides a conductive structure body including a substrate; a conductive layer; and a darkening layer, and a method of manufacturing the same. The conductive structure body prevents reflection by a conductive layer without affecting conductivity of the conductive layer, and improves a concealing property of the conductive layer by improving absorbance. Accordingly, a display panel having improved visibility is developed by using the conductive structure body.
Public/Granted literature
- US20150223326A1 CONDUCTIVE STRUCTURE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2015-08-06
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