发明授权
- 专利标题: Conductive structure and method for manufacturing same
- 专利标题(中): 导电结构及其制造方法
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申请号: US14424321申请日: 2013-08-30
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公开(公告)号: US09462682B2公开(公告)日: 2016-10-04
- 发明人: Jin Hyong Lim , Sujin Kim , Ki-Hwan Kim
- 申请人: LG CHEM, LTD.
- 申请人地址: KR Seoul
- 专利权人: LG CHEM, LTD.
- 当前专利权人: LG CHEM, LTD.
- 当前专利权人地址: KR Seoul
- 代理机构: Dentons US LLP
- 优先权: KR10-2012-0096493 20120831
- 国际申请: PCT/KR2013/007858 WO 20130830
- 国际公布: WO2014/035197 WO 20140306
- 主分类号: G06F3/045
- IPC分类号: G06F3/045 ; H05K1/02 ; G06F3/041 ; G06F3/044 ; C23C14/34 ; G06F1/16 ; H05K1/09 ; H05K3/06 ; H05K3/16 ; H05K3/46
摘要:
The disclosure provides a conductive structure body including a substrate; a conductive layer; and a darkening layer, and a method of manufacturing the same. The conductive structure body prevents reflection by a conductive layer without affecting conductivity of the conductive layer, and improves a concealing property of the conductive layer by improving absorbance. Accordingly, a display panel having improved visibility is developed by using the conductive structure body.
公开/授权文献
- US20150223326A1 CONDUCTIVE STRUCTURE AND METHOD FOR MANUFACTURING SAME 公开/授权日:2015-08-06