Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US14319648Application Date: 2014-06-30
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Publication No.: US09462686B2Publication Date: 2016-10-04
- Inventor: Se Woong Na , Min Jae Kim , Hyun Gyu Park , In Hee Cho , Man Hue Choi , Seung Kwon Hong
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: Saliwanchik, Lloyd & Eisenschenk
- Priority: KR10-2013-0077312 20130702
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/02 ; H05K3/00
Abstract:
Provided is a printed circuit board, comprising: a supporting substrate including a first region and a second region extending to be bent from the first region; an insulating substrate above the supporting substrate; a bending portion bent between the first region and the second region; and an adhesive layer between the supporting substrate and the insulating substrate and except for the bending portion.
Public/Granted literature
- US20150008017A1 PRINTED CIRCUIT BOARD Public/Granted day:2015-01-08
Information query
