Invention Grant
- Patent Title: Plug-in mechanism, subrack including plug-in mechanism, and finished board
- Patent Title (中): 插件机构,插卡机构,成品板
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Application No.: US14543265Application Date: 2014-11-17
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Publication No.: US09462719B2Publication Date: 2016-10-04
- Inventor: Dingqiang Wu , Dongli Wang , Yao Li
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Shenzhen
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Shenzhen
- Agency: Staas & Halsey LLP
- Priority: CN201210253291 20120720
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/14

Abstract:
A plug-in mechanism, a subrack and a finished board are provided. The plug-in mechanism implements fast and reliable plug-in and plug-out by using a lever assistance effect and a gearing effect of a gear. The plug-in mechanism is configured to be disposed between a sub-carrier frame and a parent carrier frame to implement plug-in and plug-out of the sub-carrier frame in the parent carrier frame, and the plug-in mechanism includes a driving part and a gearing part, where the driving part includes an ejector lever, the gearing part includes at least one gear that is engaged successively, a gear at one end is connected to the ejector lever, each of the at least one gear is fastened onto the sub-carrier frame by using a rotating shaft, and the at least one gear is connected to the parent carrier frame by using a linkage structure.
Public/Granted literature
- US20150070858A1 PLUG-IN MECHANISM, SUBRACK INCLUDING PLUG-IN MECHANISM, AND FINISHED BOARD Public/Granted day:2015-03-12
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