- 专利标题： Composition and methods of forming solder bump and flip chip using the same
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申请号： US14325482申请日： 2014-07-08
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公开(公告)号： US09462736B2公开(公告)日： 2016-10-04
- 发明人: Yong Sung Eom , Jong Tae Moon , Sangwon Oh , Keonsoo Jang
- 申请人： Electronics and Telecommunications Research Institute
- 申请人地址： KR Daejeon
- 专利权人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 当前专利权人： ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- 当前专利权人地址： KR Daejeon
- 代理机构： Rabin & Berdo, P.C.
- 优先权： KR10-2008-0067117 20080710; KR10-2009-0011106 20090211
- 主分类号： H05K13/04
- IPC分类号： H05K13/04 ; B23K3/06 ; B23K35/34 ; B23K35/36 ; B82Y10/00 ; B23K35/24 ; H05K3/46 ; H01L23/00 ; H05K3/32 ; H05K3/34
摘要：
Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
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