发明授权
- 专利标题: Laser machining apparatus that monitors material thickness and type by reflected light intensity
- 专利标题(中): 激光加工设备,通过反射光强度监测材料厚度和类型
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申请号: US13877762申请日: 2012-05-11
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公开(公告)号: US09463529B2公开(公告)日: 2016-10-11
- 发明人: Naoki Miyamoto , Kenji Kumamoto , Satoshi Nishida , Toshiki Koshimae , Hiroshi Kino , Hiroaki Kurokawa
- 申请人: Naoki Miyamoto , Kenji Kumamoto , Satoshi Nishida , Toshiki Koshimae , Hiroshi Kino , Hiroaki Kurokawa
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Electric Corporation
- 当前专利权人: Mitsubishi Electric Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 代理商 Richard C. Turner
- 优先权: JP2011-165568 20110728
- 国际申请: PCT/JP2012/062109 WO 20120511
- 国际公布: WO2013/014994 WO 20130131
- 主分类号: B23K26/06
- IPC分类号: B23K26/06 ; B23K26/38 ; B23K26/03
摘要:
The laser machining apparatus includes a transmission fiber that transmits laser light emitted from a laser oscillator through the fiber, a machining head that emits the laser light, which is sent from the transmission fiber, vertically to a main surface of a machining object and sends reflected light, which is reflected coaxially with the laser light by the machining object, to the transmission fiber, a reflected light monitoring unit that detects a reflected light intensity of the reflected light sent from the transmission fiber, and a control device that controls the laser oscillator and the machining head, in which the control device includes a determining unit that, at a time when laser machining is started, determines whether the machining object corresponds to a machining condition or not in laser machining on the basis of the reflected light intensity.
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