Invention Grant
US09464952B2 Integrated electronic device for monitoring mechanical stress within a solid structure
有权
用于监测固体结构内的机械应力的集成电子装置
- Patent Title: Integrated electronic device for monitoring mechanical stress within a solid structure
- Patent Title (中): 用于监测固体结构内的机械应力的集成电子装置
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Application No.: US14108951Application Date: 2013-12-17
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Publication No.: US09464952B2Publication Date: 2016-10-11
- Inventor: Alberto Pagani , Federico Giovanni Ziglioli , Bruno Murari
- Applicant: STMICROELECTRONICS S.R.L.
- Applicant Address: IT Agrate Brianza (MB)
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza (MB)
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Priority: ITM2012A2241 20121227
- Main IPC: G01M5/00
- IPC: G01M5/00 ; G01B5/30 ; G01B7/16 ; G01L1/00 ; G01N3/00 ; G01L1/18 ; H01L27/20
Abstract:
The integrated electronic device is for detecting a local parameter related to a force observed in a given direction, within a solid structure. The device includes at least one sensor configured to detect the above-mentioned local parameter at least in the given direction through piezo-resistive effect. At least one damping element, integrated in the device, is arranged within a frame-shaped region that is disposed around the at least one sensor and belongs to a substantially planar region comprising a plane passing through the sensor and perpendicular to the given direction. Such at least one damping element is configured to damp forces acting in the planar region and substantially perpendicular to the given direction.
Public/Granted literature
- US20140182390A1 INTEGRATED ELECTRONIC DEVICE FOR MONITORING MECHANICAL STRESS WITHIN A SOLID STRUCTURE Public/Granted day:2014-07-03
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