Invention Grant
- Patent Title: Semiconductor device with fin and related methods
- Patent Title (中): 半导体器件与鳍片及相关方法
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Application No.: US14663843Application Date: 2015-03-20
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Publication No.: US09466718B2Publication Date: 2016-10-11
- Inventor: Pierre Morin , Nicolas Loubet
- Applicant: STMICROELECTRONICS, INC.
- Applicant Address: US TX Coppell
- Assignee: STMICROELECTRONICS, INC.
- Current Assignee: STMICROELECTRONICS, INC.
- Current Assignee Address: US TX Coppell
- Agency: Seed IP Law Group PLLC
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/78 ; H01L29/66 ; H01L29/165

Abstract:
A semiconductor device may include a substrate, a fin above the substrate and having a channel region therein, and source and drain regions adjacent the channel region to generate shear and normal strain on the channel region. A semiconductor device may include a substrate, a fin above the substrate and having a channel region therein, source and drain regions adjacent the channel region, and a gate over the channel region. The fin may be canted with respect to the source and drain regions to generate shear and normal strain on the channel region.
Public/Granted literature
- US20150279994A1 SEMICONDUCTOR DEVICE WITH FIN AND RELATED METHODS Public/Granted day:2015-10-01
Information query
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