Invention Grant
US09472443B2 Selectively groundable cover ring for substrate process chambers 有权
用于基板处理室的选择性可底座盖环

Selectively groundable cover ring for substrate process chambers
Abstract:
Embodiments of a process kit for substrate process chambers are provided herein. In some embodiments, a process kit for a substrate process chamber may include a ring having a body and a lip extending radially inward from the body, wherein the body has a first annular channel formed in a bottom of the body; an annular conductive shield having a lower inwardly extending ledge that terminates in an upwardly extending portion configured to interface with the first annular channel of the ring; and a conductive member electrically coupling the ring to the conductive shield when the ring is disposed on the conductive shield.
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