Invention Grant
- Patent Title: Semiconductor memory device and method of fabricating the same
- Patent Title (中): 半导体存储器件及其制造方法
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Application No.: US14472765Application Date: 2014-08-29
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Publication No.: US09472445B2Publication Date: 2016-10-18
- Inventor: Sang-Il Han , Jong-Un Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2013-0161552 20131223
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L21/762 ; H01L29/06 ; H01L21/8234 ; H01L21/768 ; H01L27/108

Abstract:
A semiconductor memory device including a substrate, a first element isolation film pattern, and a second element isolation film pattern. The substrate includes a first region and a second region. The first element isolation film pattern is in the first region and corresponds to a first active region. The second element isolation film pattern is in the second region and corresponds to a second active region. The first element isolation film pattern includes a first material and the second element isolation film pattern includes a second material different from the first material.
Public/Granted literature
- US20150179641A1 SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2015-06-25
Information query
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