发明授权
- 专利标题： Methods for making semiconductor device with sealing resin
- 专利标题（中）： 制造具有密封树脂的半导体器件的方法
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申请号： US14716364申请日： 2015-05-19
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公开(公告)号： US09472540B2公开(公告)日： 2016-10-18
- 发明人: Masanori Onodera , Kouichi Meguro , Junji Tanaka
- 申请人： VALLEY DEVICE MANAGEMENT
- 申请人地址： US DE Wilmington
- 专利权人： VALLEY DEVICE MANAGEMENT
- 当前专利权人： VALLEY DEVICE MANAGEMENT
- 当前专利权人地址： US DE Wilmington
- 代理机构： Van Court & Aldridge LLP
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; H01L25/00 ; H01L21/56 ; H01L21/683 ; H01L25/065 ; G06F1/18 ; H01L23/00 ; H01L23/31 ; H01L23/66 ; H01L25/18
摘要：
Various embodiments of the present invention include a method for making a semiconductor device the method including disposing a first semiconductor chip on a first surface of a first substrate, the first substrate comprising a second surface opposing the first surface, depositing a first resin above the first semiconductor chip, disposing a built-in semiconductor device on the first resin. The built-in semiconductor device including a second substrate, a second semiconductor chip disposed on the second substrate, and a second resin that seals the second semiconductor chip. The method including depositing a third resin above the built-in semiconductor device and the first resin and covering a side surface of the first substrate and not extending beyond the second surface of the first substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device fabrication method, in which downsizing and cost reduction can be realized.
公开/授权文献
- US20150255446A1 SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORE 公开/授权日：2015-09-10
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