Invention Grant
- Patent Title: Integrated power delivery system for printed circuit boards
- Patent Title (中): 用于印刷电路板的集成电力输送系统
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Application No.: US14429140Application Date: 2014-07-16
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Publication No.: US09472924B2Publication Date: 2016-10-18
- Inventor: Jared P. Majcher , Timothy M. Dresser
- Applicant: BAE Systems Information and Electronic Systems Integration Inc.
- Applicant Address: US NH Nashua
- Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee Address: US NH Nashua
- Agent Daniel J. Long; Antony P. Ng; Scott J. Asmus
- International Application: PCT/US2014/046777 WO 20140716
- International Announcement: WO2015/009775 WO 20150122
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H02B1/56 ; H05K7/20 ; H01R4/48 ; H01R12/52 ; H02B1/20 ; H01Q21/00
Abstract:
An integrated DC power delivery system for PCBs is disclosed. In one embodiment, the system includes a compliant mechanical coupling assembly. The system further includes a power distribution interface having power planes configured to receive the DC power via the complaint mechanical coupling assembly upon securing the compliant mechanical coupling to the power distribution interface to provide the needed mechanical support.
Public/Granted literature
- US20150214642A1 INTEGRATED POWER DELIVERY SYSTEM FOR PRINTED CIRCUIT BOARDS Public/Granted day:2015-07-30
Information query
