发明授权
- 专利标题: Powder removing apparatus, molding system, and method of manufacturing molded object
- 专利标题(中): 除粉装置,成型系统及成形体的制造方法
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申请号: US13590689申请日: 2012-08-21
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公开(公告)号: US09475234B2公开(公告)日: 2016-10-25
- 发明人: Hiroaki Morikawa
- 申请人: Hiroaki Morikawa
- 申请人地址: JP Tokyo
- 专利权人: SONY CORPORATION
- 当前专利权人: SONY CORPORATION
- 当前专利权人地址: JP Tokyo
- 代理机构: Chip Law Group
- 优先权: JP2011-186676 20110830
- 主分类号: B29C67/00
- IPC分类号: B29C67/00
摘要:
A powder removing apparatus includes a box, a stage moving mechanism, and a powder removing processing mechanism. The box has a main body with an opening and a stage movably provided in the main body. The box is capable of accommodating a molded object and non-bonding powder so as to arrange the molded object, which is formed using powder according to a rapid prototyping technique, on the stage together with the non-bonding powder. The stage moving mechanism is capable of moving the stage upward relative to the main body inside the main body. The powder removing processing mechanism is configured to remove the non-bonding powder existing around the molded object extruded by a driving operation of the stage moving mechanism via the opening.
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