Invention Grant
- Patent Title: Probe tip heating assembly
- Patent Title (中): 探头尖加热装置
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Application No.: US14358065Application Date: 2012-11-14
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Publication No.: US09476816B2Publication Date: 2016-10-25
- Inventor: Roger William Schmitz , Yunje Oh
- Applicant: Hysitron, Inc.
- Applicant Address: US MN Eden Prairie
- Assignee: Hysitron, Inc.
- Current Assignee: Hysitron, Inc.
- Current Assignee Address: US MN Eden Prairie
- Agency: Schwegman Lundberg & Woessner, P.A.
- International Application: PCT/US2012/065009 WO 20121114
- International Announcement: WO2013/074623 WO 20130523
- Main IPC: G01N3/40
- IPC: G01N3/40 ; H05B3/03 ; G01Q30/02 ; G01Q30/10 ; G01Q60/36 ; G01N3/42

Abstract:
A heating assembly configured for use in mechanical testing at a scale of microns or less. The heating assembly includes a probe tip assembly configured for coupling with a transducer of the mechanical testing system. The probe tip assembly includes a probe tip heater system having a heating element, a probe tip coupled with the probe tip heater system, and a heater socket assembly. The heater socket assembly, in one example, includes a yoke and a heater interface that form a socket within the heater socket assembly. The probe tip heater system, coupled with the probe tip, is slidably received and clamped within the socket.
Public/Granted literature
- US20140326707A1 PROBE TIP HEATING ASSEMBLY Public/Granted day:2014-11-06
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