Invention Grant
- Patent Title: Forming 3-D nano-particle assemblies
- Patent Title (中): 形成3-D纳米颗粒组件
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Application No.: US13754404Application Date: 2013-01-30
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Publication No.: US09476833B2Publication Date: 2016-10-25
- Inventor: Steven J. Barcelo , Zhiyong Li , Ansoon Kim , Zhang-Lin Zhou , Gary Gibson
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Devleopment Company, L.P.
- Current Assignee: Hewlett-Packard Devleopment Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: Mannava & Kang, P.C.
- Main IPC: G01N33/00
- IPC: G01N33/00 ; G01N21/65 ; B82Y40/00

Abstract:
According to an example, methods for forming three-dimensional (3-D) nano-particle assemblies include depositing SES elements onto respective tips of nano-fingers, in which the nano-fingers are arranged in sufficiently close proximities to each other to enable the tips of groups of adjacent ones of the nano-fingers to come into sufficiently close proximities to each other to enable the SES elements on the tips to be bonded together when the nano-fingers are partially collapsed. The methods also include causing the nano-fingers to partially collapse toward adjacent ones of the nano-fingers to cause a plurality of SES elements on respective groups of the nano-fingers to be in relatively close proximities to each other and form respective clusters of SES elements, introducing additional particles that are to attach onto the clusters of SES elements, and causing the clusters of SES elements to detach from the nano-fingers.
Public/Granted literature
- US20140209837A1 FORMING 3-D NANO-PARTICLE ASSEMBLIES Public/Granted day:2014-07-31
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