Invention Grant
- Patent Title: Application of a continuous substrate with segmented adhesive
- Patent Title (中): 连续基材与分段粘合剂的应用
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Application No.: US14376063Application Date: 2013-02-05
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Publication No.: US09477059B2Publication Date: 2016-10-25
- Inventor: Donald K. Larson , Zachary M. Thompson , Curtis E. Maynes
- Applicant: 3M INNOVATIVE PROPERTIES COMPANY
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Janet A. Kling
- International Application: PCT/US2013/024689 WO 20130205
- International Announcement: WO2013/119515 WO 20130815
- Main IPC: B29C53/56
- IPC: B29C53/56 ; G02B6/44 ; H02G3/00 ; H01B11/18 ; H02G3/30
Abstract:
A system for adhering a length of continuous substrate to a mounting surface is disclosed. The continuous substrate can be attached to a mounting surface by a regular array of spaced apart adhesive segments disposed longitudinally along the continuous substrate and between the mounting surface and the continuous substrate.
Public/Granted literature
- US20150020956A1 APPLICATION OF A CONTINUOUS SUBSTRATE WITH SEGMENTED ADHESIVE Public/Granted day:2015-01-22
Information query
