发明授权
- 专利标题: Integrated device
- 专利标题(中): 集成设备
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申请号: US14389103申请日: 2013-02-28
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公开(公告)号: US09478503B2公开(公告)日: 2016-10-25
- 发明人: Mitsutoshi Makihata , Masayoshi Esashi , Shuji Tanaka , Masanori Muroyama , Hirofumi Funabashi , Yutaka Nonomura , Yoshiyuki Hata , Hitoshi Yamada , Takahiro Nakayama , Ui Yamaguchi
- 申请人: Mitsutoshi Makihata , Masayoshi Esashi , Shuji Tanaka , Masanori Muroyama , Hirofumi Funabashi , Yutaka Nonomura , Yoshiyuki Hata , Hitoshi Yamada , Takahiro Nakayama , Ui Yamaguchi
- 申请人地址: JP Sendai-Shi JP Nagakute-Shi JP Toyota-Shi
- 专利权人: TOHOKU UNIVERSITY,KABUSHIKI KAISHA TOYOTA CHUO-KENKYUSHO,TOYOTA JIDOSHA KABUSHIKI KAISHA
- 当前专利权人: TOHOKU UNIVERSITY,KABUSHIKI KAISHA TOYOTA CHUO-KENKYUSHO,TOYOTA JIDOSHA KABUSHIKI KAISHA
- 当前专利权人地址: JP Sendai-Shi JP Nagakute-Shi JP Toyota-Shi
- 代理机构: Kenyon & Kenyon LLP
- 优先权: JP2012-079811 20120330
- 国际申请: PCT/JP2013/001218 WO 20130228
- 国际公布: WO2013/145555 WO 20131003
- 主分类号: H01L23/552
- IPC分类号: H01L23/552 ; H01L23/538 ; B81B7/00 ; H01L21/78 ; H01L21/683 ; H01L21/306 ; H01L25/18 ; H01L27/06 ; H01L25/07 ; H01L25/16 ; B81C1/00 ; H01L25/00 ; H01L29/06
摘要:
An integrated device with high insulation tolerance is provided. A groove having an inclined side surface is provided between adjacent devices. When a side where an electronic circuit or MEMS device is mounted is a front surface, the groove becomes narrower from the front surface to a back surface because of the inclined surface. A mold material (insulating material) is disposed inside the groove, so that the plurality of devices are mechanically joined together, being electrically insulated from one another. A line member that establishes an electrical conduction between the adjacent devices is formed to lie along the side surface and the bottom surface of the groove. To lead the line out to the backside, the bottom surface of the groove has a hole, so that the line member is exposed to the backside from the hole.
公开/授权文献
- US20150333046A1 INTEGRATED DEVICE 公开/授权日:2015-11-19