Invention Grant
US09478562B2 Array substrate and manufacturing method thereof, display device, thin film transistor and manufacturing method thereof
有权
阵列基板及其制造方法,显示装置,薄膜晶体管及其制造方法
- Patent Title: Array substrate and manufacturing method thereof, display device, thin film transistor and manufacturing method thereof
- Patent Title (中): 阵列基板及其制造方法,显示装置,薄膜晶体管及其制造方法
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Application No.: US14646416Application Date: 2014-09-23
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Publication No.: US09478562B2Publication Date: 2016-10-25
- Inventor: Chunping Long , Zheng Liu , Zuqiang Wang , Jang Soon Im
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Collard & Roe, P.C.
- Priority: CN201410226377 20140527
- International Application: PCT/CN2014/087139 WO 20140923
- International Announcement: WO2015/180320 WO 20151203
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/12 ; H01L29/66 ; H01L29/786 ; H01L27/32

Abstract:
An array substrate and manufacturing method thereof, a display device, a thin film transistor and manufacturing method thereof are provided. The manufacturing method of an array substrate includes forming an active material layer (501), a gate insulating layer (204) and a metal thin film (502) on a base substrate (201), and forming a pattern including an active layer (203) and a pattern including a gate electrode (205), a source electrode (206), a drain electrode (207), a gate line (1063) and a data line (1061) by a first patterning process; forming a passivation layer (301) on the base substrate (201), and forming a source contact hole (302), a drain contact hole (303), and an bridge-structure contact hole (1062a) by a second patterning process; forming a transparent conductive thin film (1401) on the base substrate (201), and removing the transparent conductive thin film (1404) partially, so that a source contact section (401), a drain contact section (402), a pixel electrode (403), and an bridge structure (1062) are formed. With the manufacturing method, the use number of patterning processes is decreased.
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