Invention Grant
- Patent Title: Chemical mechanical polishing apparatus and polishing method using the same
- Patent Title (中): 化学机械抛光装置和使用其的抛光方法
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Application No.: US14073641Application Date: 2013-11-06
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Publication No.: US09481069B2Publication Date: 2016-11-01
- Inventor: Yuan-Hsuan Chen , Sheng-Chen Wang , Feng-Inn Wu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: B24B37/24
- IPC: B24B37/24 ; B24B37/04 ; B24B37/10
Abstract:
A chemical mechanical polishing apparatus includes a platen, a polishing head, a magnetizable polishing pad, and an electromagnetic component. The magnetizable polishing pad is disposed between the polishing head and the platen. The electromagnetic component is configured for fastening the magnetizable polishing pad on the platen.
Public/Granted literature
- US20150126095A1 CHEMICAL MECHANICAL POLISHING APPARATUS AND POLISHING METHOD USING THE SAME Public/Granted day:2015-05-07
Information query
