Invention Grant
- Patent Title: System and method for predicting the temperature of a device
- Patent Title (中): 用于预测设备温度的系统和方法
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Application No.: US13776973Application Date: 2013-02-26
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Publication No.: US09482584B2Publication Date: 2016-11-01
- Inventor: Yun-hyeok Im , Kyol Park , Tae-je Cho
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2012-0031819 20120328
- Main IPC: G01K7/00
- IPC: G01K7/00 ; G01K7/34 ; G01K7/16 ; G01K7/42
Abstract:
A method of predicting a temperature includes operatively coupling a temperature prediction circuit to a device including a semiconductor chip, determining a correlation between a current and voltage of the temperature prediction circuit, and predicting a temperature with respect to power applied to the device using the determined correlation.
Public/Granted literature
- US20130259092A1 SYSTEM AND METHOD FOR PREDICTING THE TEMPERATURE OF A DEVICE Public/Granted day:2013-10-03
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