发明授权
US09484196B2 Semiconductor structures including liners comprising alucone and related methods
有权
半导体结构，包括含有alucone的衬垫和相关方法
- 专利标题： Semiconductor structures including liners comprising alucone and related methods
- 专利标题（中）： 半导体结构，包括含有alucone的衬垫和相关方法
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申请号： US14189323申请日： 2014-02-25
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公开(公告)号： US09484196B2公开(公告)日： 2016-11-01
- 发明人: Zhe Song , Tuman E. Allen , Cole S. Franklin , Dan Gealy
- 申请人： Micron Technology, Inc.
- 申请人地址： US ID Boise
- 专利权人： MICRON TECHNOLOGY, INC.
- 当前专利权人： MICRON TECHNOLOGY, INC.
- 当前专利权人地址： US ID Boise
- 代理机构： TraskBritt
- 主分类号： H01L21/02
- IPC分类号： H01L21/02 ; H01L45/00 ; H01L27/115 ; H01L21/033 ; H01L27/24
摘要：
A semiconductor device including stacked structures. The stacked structures include at least two chalcogenide materials or alternating dielectric materials and conductive materials. A liner including alucone is formed on sidewalls of the stacked structures. Methods of forming the semiconductor device are also disclosed.
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