Invention Grant
- Patent Title: Sacrificial carrier dicing of semiconductor wafers
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Application No.: US14858014Application Date: 2015-09-18
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Publication No.: US09484239B2Publication Date: 2016-11-01
- Inventor: Richard S. Graf , Douglas O. Powell , David J. Russell , David J. West
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Francis Lammes; Stephen J. Walder, Jr.; Damion Josephs
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/683 ; H01L21/268 ; H01L21/304 ; H01L21/67 ; H01L23/544
Abstract:
Mechanisms are provided for sacrificial carrier dicing of semiconductor wafers. A bottom layer of a semiconductor wafer is bonded to a top layer of a sacrificial carrier. The semiconductor wafer is diced into a set of chips, such that the dicing cuts through the semiconductor wafer and into the sacrificial carrier and such that the sacrificial carrier dresses a diamond blade of a saw so as to expose one or more new, sharp layers of diamonds on the diamond blade.
Public/Granted literature
- US20160079111A1 Sacrificial Carrier Dicing of Semiconductor Wafers Public/Granted day:2016-03-17
Information query
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