Invention Grant
US09484240B2 Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device
有权
薄膜粘合剂，带胶粘剂的切割胶带，半导体装置的制造方法以及半导体装置
- Patent Title: Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device
- Patent Title (中): 薄膜粘合剂，带胶粘剂的切割胶带，半导体装置的制造方法以及半导体装置
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Application No.: US14183823Application Date: 2014-02-19
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Publication No.: US09484240B2Publication Date: 2016-11-01
- Inventor: Yuki Sugo , Yuta Kimura
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Knobbe Martens Olson & Bear, LLP
- Priority: JP2013-031336 20130220; JP2014-001514 20140108
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L23/48 ; H01L21/50 ; C09J7/02 ; C09J9/02 ; C09J11/04 ; H01L23/00 ; C08G59/62 ; C09J163/00 ; C08K3/08
Abstract:
The present invention provides a film adhesive that can prevent a thermal effect to a semiconductor wafer and that can suppress warping of the semiconductor wafer; a dicing tape with a film adhesive; and a method of manufacturing a semiconductor device.The present invention relates to a film adhesive comprising a thermoplastic resin and electrically conductive particles, the film adhesive having an adhesion strength measured at 25° C. after the film adhesive is pasted to a mirror silicon wafer at 40° C. of 0.5 N/10 mm or more.
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