Invention Grant
- Patent Title: Fin structure of fin field effect transistor
- Patent Title (中): 翅片场效应晶体管的鳍结构
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Application No.: US12766233Application Date: 2010-04-23
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Publication No.: US09484462B2Publication Date: 2016-11-01
- Inventor: Feng Yuan , Hung-Ming Chen , Tsung-Lin Lee , Chang-Yun Chang , Clement Hsingjen Wann
- Applicant: Feng Yuan , Hung-Ming Chen , Tsung-Lin Lee , Chang-Yun Chang , Clement Hsingjen Wann
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78 ; H01L29/66

Abstract:
An exemplary structure for the fin field effect transistor comprises a substrate comprising a major surface; a plurality of fin structures protruding from the major surface of the substrate, wherein each fin structure comprises an upper portion and a lower portion separated at a transition location at where the sidewall of the fin structure is at an angle of 85 degrees to the major surface of the substrate, wherein the upper portion has sidewalls that are substantially perpendicular to the major surface of the substrate and a top surface having a first width, wherein the lower portion has tapered sidewalls on opposite sides of the upper portion and a base having a second width larger than the first width; and a plurality of isolation structures between the fin structures, wherein each isolation structure extends from the major surface of the substrate to a point above the transition location.
Public/Granted literature
- US20110068405A1 FIN FIELD EFFECT TRANSISTOR Public/Granted day:2011-03-24
Information query
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