Invention Grant
- Patent Title: Board assembly and electronic device including the same
- Patent Title (中): 板组装和电子设备包括相同
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Application No.: US14154898Application Date: 2014-01-14
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Publication No.: US09484767B2Publication Date: 2016-11-01
- Inventor: Tae Seok Yang , Gun Ah Kim , Ted Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: NSIP Law
- Priority: KR10-2013-0133158 20131104
- Main IPC: H02J7/00
- IPC: H02J7/00 ; H02J7/04 ; H02J7/02 ; H02J5/00 ; H01M10/42
Abstract:
There is provided a wireless power transmitter, including: a board having circuit wiring thereon; a connector mounted on a surface of the board; a terminal pin formed on one side of the connector and penetrating through the board; and a battery provided on the other surface of the board to be coupled to the terminal pin.
Public/Granted literature
- US20150123603A1 BOARD ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2015-05-07
Information query
