Provided herein is a contact patterning apparatus comprising: a substrate; a fluid supply unit configured to supply fluid towards the substrate; a voltage applying unit electrically connected to the fluid supply unit, and configured to make the fluid from the fluid supply unit connected between the substrate and the fluid supply unit by applying a voltage to a surface of the fluid; and a control unit configured to adjust a level of the voltage being applied to the fluid such that the fluid is patterned on the substrate in a dots form or a continuous line form, thereby stably patterning a continuous line of a fine line width regardless of the viscosity of the fluid being used and the patterning velocity.