Invention Grant
- Patent Title: Systems and methods for fabrication of superconducting integrated circuits
- Patent Title (中): 用于制造超导集成电路的系统和方法
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Application No.: US14589574Application Date: 2015-01-05
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Publication No.: US09490296B2Publication Date: 2016-11-08
- Inventor: Eric Ladizinsky , Geordie Rose , Jeremy P. Hilton , Eugene Dantsker , Byong Hyop Oh
- Applicant: D-Wave Systems Inc.
- Applicant Address: CA Burnaby
- Assignee: D-WAVE SYSTEMS INC.
- Current Assignee: D-WAVE SYSTEMS INC.
- Current Assignee Address: CA Burnaby
- Agency: Seed IP Law Group LLP
- Main IPC: H01L27/18
- IPC: H01L27/18 ; B82Y10/00 ; G06N99/00 ; H01L39/22 ; H01L39/24 ; H01L49/02 ; H01L39/02

Abstract:
Various techniques and apparatus permit fabrication of superconductive circuits and structures, for instance Josephson junctions, which may, for example be useful in quantum computers. For instance, a low magnetic flux noise trilayer structure may be fabricated having a dielectric structure or layer interposed between two elements or layers capable of superconducting. A superconducting via may directly overlie a Josephson junction. A structure, for instance a Josephson junction, may be carried on a planarized dielectric layer. A fin may be employed to remove heat from the structure. A via capable of superconducting may have a width that is less than about 1 micrometer. The structure may be coupled to a resistor, for example by vias and/or a strap connector.
Public/Granted literature
- US20150187840A1 SYSTEMS AND METHODS FOR FABRICATION OF SUPERCONDUCTING INTEGRATED CIRCUITS Public/Granted day:2015-07-02
Information query
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