An electronic device includes a circuit board, first and second electronic components, a housing, and a heat conduction member. The first electronic component is mounted on a first surface of the circuit board, and the second electronic component is mounted on a second surface of the circuit board. The first electronic component and the second electronic component are arranged in an arrangement direction. The heat conduction member is disposed between the housing and a first component-opposite portion of the circuit board opposite to the first electronic component, and between the housing and a second component-opposite portion of the circuit board opposite to the second electronic component. The circuit board has a through hole in a formation area between the first electronic component and the second electronic component. The heat conduction member integrally covers each of the first component-opposite portion and the second component-opposite portion and the formation area of the circuit board.