发明授权
- 专利标题： Electrically conductive structural adhesive
- 专利标题（中）： 导电结构胶
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申请号： US14170829申请日： 2014-02-03
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公开(公告)号： US09493682B2公开(公告)日： 2016-11-15
- 发明人: Susan L. Levandoski , Timothy P. Walsh , Sam Bail
- 申请人： Susan L. Levandoski , Timothy P. Walsh , Sam Bail
- 申请人地址： DE Duesseldorf
- 专利权人： Henkel IP & Holding GmbH
- 当前专利权人： Henkel IP & Holding GmbH
- 当前专利权人地址： DE Duesseldorf
- 代理商 Steven C. Bauman
- 主分类号： C09J9/02
- IPC分类号： C09J9/02 ; C09J133/08 ; C09J11/04 ; C08K3/04
摘要：
The present invention relates to curable compositions which are capable of safely and sufficiently bonding components of electrical devices. In particular, the invention relates to electrically conductive, curable compositions, which are capable of rapidly curing at room temperatures as well as at elevated temperatures.
公开/授权文献
- US20140220243A1 ELECTRICALLY CONDUCTIVE STRUCTURAL ADHESIVE 公开/授权日：2014-08-07
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