Invention Grant
US09496237B2 Semiconductor device having solderable and bondable electrical contact pads
有权
具有可焊接和可粘合的电接触焊盘的半导体器件
- Patent Title: Semiconductor device having solderable and bondable electrical contact pads
- Patent Title (中): 具有可焊接和可粘合的电接触焊盘的半导体器件
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Application No.: US14715778Application Date: 2015-05-19
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Publication No.: US09496237B2Publication Date: 2016-11-15
- Inventor: Gottfried Beer , Raimund Foerg , Juergen Hoegerl
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102014107018 20140519
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/522 ; H01L23/48
Abstract:
A semiconductor device includes a semiconductor chip and a plurality of electrical contact pads disposed on a main face of the semiconductor chip, wherein the electrical contact pads each include a layer stack, each layer stack having one and the same order of layers, and wherein the electrical contact pads are both solderable and bondable.
Public/Granted literature
- US20150333023A1 Semiconductor Device Having Solderable and Bondable Electrical Contact Pads Public/Granted day:2015-11-19
Information query
IPC分类:
