Invention Grant
- Patent Title: Plastic electronic device structures with embedded components
- Patent Title (中): 具有嵌入式元件的塑料电子器件结构
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Application No.: US14263749Application Date: 2014-04-28
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Publication No.: US09496602B2Publication Date: 2016-11-15
- Inventor: Darshan R. Kasar
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group, P.C.
- Agent G. Victor Treyz; Zachary D. Hadd
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/18 ; H05K7/00 ; H01Q1/24 ; H05K3/28 ; H05K9/00 ; H01Q1/42

Abstract:
Circuitry such as electrical components and wires and traces on flexible printed circuits can be embedded within injection-molded plastic structures. The electrical components can include integrated circuits, connectors, and system-in-package circuit modules. The system-in-package circuit modules may include components mounted on a substrate and covered with plastic. The connectors may include a connector for mating with a corresponding connector on an electronic device or a battery. The injection-molded plastic structures may form a housing. The housing may form part of an electronic device, an external case that receives an electronic device, or other structures. A near-field communications antenna may be embedded within a plastic housing. Signal wires and plastic fibers may be interlaced to form a mesh that is embedded in the plastic housing or other injection molded plastic structure.
Public/Granted literature
- US20150313003A1 Plastic Electronic Device Structures With Embedded Components Public/Granted day:2015-10-29
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