发明授权
- 专利标题: Insulating sheet, circuit board, and process for production of insulating sheet
- 专利标题(中): 绝缘片,电路板及绝缘片生产工艺
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申请号: US13498784申请日: 2010-09-13
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公开(公告)号: US09497857B2公开(公告)日: 2016-11-15
- 发明人: Kenji Miyata , Toshitaka Yamagata
- 申请人: Kenji Miyata , Toshitaka Yamagata
- 申请人地址: JP Tokyo
- 专利权人: Denka Company Limited
- 当前专利权人: Denka Company Limited
- 当前专利权人地址: JP Tokyo
- 代理机构: Roberts Mlotkowski Safran Cole & Calderon, PC
- 优先权: JP2009-243151 20091022
- 国际申请: PCT/JP2010/065703 WO 20100913
- 国际公布: WO2011/048885 WO 20110428
- 主分类号: B32B15/08
- IPC分类号: B32B15/08 ; H05K1/03 ; C08G59/42 ; C08G59/62 ; C08L63/00
摘要:
An object of the present invention is to provide an insulating sheet superior in heat dissipation efficiency, heat resistance, insulation efficiency and moldability. Provided is a sheet-shaped insulating sheet of a resin composition containing an epoxy resin, a curing agent and an inorganic filler, wherein one or both of the epoxy resin and the curing agent have a naphthalene structure, the inorganic filler contains hexagonal boron nitride, and the inorganic filler is contained in an amount of 70 to 85 vol % in the entire resin composition. It is possible to increase the filling efficiency of an inorganic filler in the insulating sheet by using an epoxy resin and/or a curing agent having a naphthalene structure, which are favorably compatible with the hexagonal boron nitride contained in the inorganic filler.
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