Invention Grant
- Patent Title: Molding packaging material
- Patent Title (中): 成型包装材料
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Application No.: US14269270Application Date: 2014-05-05
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Publication No.: US09502695B2Publication Date: 2016-11-22
- Inventor: Yuji Minamibori
- Applicant: Showa Denko Packaging Co., Ltd.
- Applicant Address: JP Kanagawa
- Assignee: Showa Denko Packaging Co., Ltd.
- Current Assignee: Showa Denko Packaging Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: Keating and Bennett, LLP
- Priority: JP2013-098136 20130508; JP2014-047426 20140311
- Main IPC: H01M2/02
- IPC: H01M2/02 ; B32B15/092 ; B32B15/095

Abstract:
A molding packaging material including a matte coat layer having excellent formability, chemical resistance, solvent resistance, and printability is provided. The molding packaging material 1 includes an outer base material 13 made of a heat-resistant resin, an inner sealant layer 16 made of a thermoplastic resin, a metal foil layer 11 arranged between the outer base material 13 and the inner sealant layer 16, and a matte coat layer 14 formed on one side of the outer base material opposite to the other side thereof to which the metal foil layer 11 is arranged. The matte coat layer 14 is made from a resin composition containing a base compound resin including a phenoxy resin and a urethane resin, a curing agent, and solid fine particles.
Public/Granted literature
- US20140335402A1 MOLDING PACKAGING MATERIAL Public/Granted day:2014-11-13
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