Invention Grant
- Patent Title: Connector device
- Patent Title (中): 连接器装置
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Application No.: US14523393Application Date: 2014-10-24
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Publication No.: US09502799B2Publication Date: 2016-11-22
- Inventor: Jorge L. Garcia , Richard K. Schmid , Anthony J. Suppelsa
- Applicant: MOTOROLA SOLUTIONS, INC
- Applicant Address: US IL Chicago
- Assignee: MOTOROLA SOLUTIONS, INC.
- Current Assignee: MOTOROLA SOLUTIONS, INC.
- Current Assignee Address: US IL Chicago
- Agent Barbara R. Doutre
- Main IPC: H01R12/00
- IPC: H01R12/00 ; H05K1/00 ; H01R12/72

Abstract:
A connector (200) provides improved robustness and strength with a header (202) configured to retain and expose a plurality of receptacles (204). The exposed portion of each receptacle provides a surface mount solderable element as part of the overall connector. Another embodiment further provides a lead (208) extending from the exposed portion of the receptacle to provide an additional leaded solderable element to the connector. Thus, the connector can provide both surface mount capability and/or a combination of surface mount and lead mount capability. The exposed portions of the receptacles may be soldered flush to a board (302), thus minimizing z-height of the connector to the board and allowing for a larger sized diameter receptacle.
Public/Granted literature
- US20160118732A1 CONNECTOR DEVICE Public/Granted day:2016-04-28
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