A method for solvent-less adhesive bonding is provided comprising depositing thin, functional, polymeric films on one or more substrates and bonding the substrates to each other or to other substrates. Depositing the polymeric films, including, for example, chemically reactive polymers and thermoplastics with adhesive qualities, may be accomplished using an initiated chemical vapor deposition technique compatible with a variety of monomers, including monomers with chemically functional moieties such as amine and epoxy groups. The technique allows for deposition of polymeric films on a wide variety of substrates/devices and provides an alternative for other coating/deposition methods that are incompatible with certain substrates/devices and/or do not provide adequate control over the resulting polymeric film. The provided method is advantageous in that it is applicable to fabrication of hybrid devices and is compatible with microfabrication technology, including that in clean-room settings.