Invention Grant
- Patent Title: Electronic component fabrication method using removable spacers
- Patent Title (中): 使用可拆卸间隔件的电子元件制造方法
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Application No.: US14261728Application Date: 2014-04-25
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Publication No.: US09508490B2Publication Date: 2016-11-29
- Inventor: William S. H. Cheung
- Applicant: YEN TECHNOLOGIES, LLC
- Applicant Address: US DE Wilmington
- Assignee: YEN TECHNOLOGIES, LLC
- Current Assignee: YEN TECHNOLOGIES, LLC
- Current Assignee Address: US DE Wilmington
- Main IPC: H01G4/02
- IPC: H01G4/02 ; H01G2/10 ; H01G4/30

Abstract:
An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes.
Public/Granted literature
- US20140233151A1 ELECTRONIC COMPONENT FABRICATION METHOD USING REMOVABLE SPACERS Public/Granted day:2014-08-21
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