Invention Grant
- Patent Title: Non-volatile memory structure and manufacturing method thereof
- Patent Title (中): 非易失性存储器结构及其制造方法
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Application No.: US13741399Application Date: 2013-01-15
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Publication No.: US09508835B2Publication Date: 2016-11-29
- Inventor: Wen-Chung Chang , Shen-De Wang , Ya-Huei Huang , Feng-Ji Tsai , Chien-Hung Chen
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L29/66 ; H01L29/792 ; H01L29/423 ; H01L21/28

Abstract:
A method for manufacturing a non-volatile memory structure includes providing a substrate having a memory region and a logic region defined thereon, masking the logic region while forming at least a first gate in the memory region, forming an oxide-nitride-oxide (ONO) structure under the first gate, forming an oxide structure covering the ONO structure on the substrate, masking the memory region while forming a second gate in the logic region, and forming a first spacer on sidewalls of the first gate and a second spacer on sidewalls of the second gate simultaneously.
Public/Granted literature
- US20140197472A1 NON-VOLATILE MEMORY STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2014-07-17
Information query
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