Invention Grant
- Patent Title: Double diaphragm MEMS microphone without a backplate element
- Patent Title (中): 双隔膜MEMS麦克风无背板元件
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Application No.: US14198657Application Date: 2014-03-06
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Publication No.: US09510107B2Publication Date: 2016-11-29
- Inventor: Alfons Dehe , Marina Fekry Megally Bastarous
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H04R19/04
- IPC: H04R19/04 ; H04R19/00 ; B81C1/00

Abstract:
A sensor structure may include a first suspended structure and a second suspended structure disposed from the first suspended structure to form a volume. The first suspended structure and the second suspended structure may be arranged relative to each other such that a received pressure wave entering the volume between the first suspended structure and the second suspended structure generates a displacement of the first suspended structure to a first direction and a displacement of the second suspended structure to a second direction different from the first direction and the displacement may generate a measurable signal.
Public/Granted literature
- US20150256940A1 DOUBLE DIAPHRAGM MEMS MICROPHONE WITHOUT A BACKPLATE ELEMENT Public/Granted day:2015-09-10
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