发明授权
- 专利标题: Silver-white copper alloy and method of producing silver-white copper alloy
- 专利标题(中): 银白铜合金和银白铜合金的制造方法
-
申请号: US14115062申请日: 2012-06-27
-
公开(公告)号: US09512507B2公开(公告)日: 2016-12-06
- 发明人: Shinji Tanaka , Keiichiro Oishi , Hiroharu Ogawa
- 申请人: Shinji Tanaka , Keiichiro Oishi , Hiroharu Ogawa
- 申请人地址: JP Tokyo JP Tokyo
- 专利权人: MITSUBISHI MATERIALS CORPORATION,MITSUBISHI SHINDOH CO., LTD.
- 当前专利权人: MITSUBISHI MATERIALS CORPORATION,MITSUBISHI SHINDOH CO., LTD.
- 当前专利权人地址: JP Tokyo JP Tokyo
- 代理机构: Griffin and Szipl PC
- 优先权: JPP2011-143883 20110629
- 国际申请: PCT/JP2012/066356 WO 20120627
- 国际公布: WO2013/002247 WO 20130103
- 主分类号: C22C9/04
- IPC分类号: C22C9/04 ; C22F1/08
摘要:
Provided are a silver-white copper alloy which has superior mechanical properties such as hot workability, cold workability, or press property, color fastness, bactericidal and antibacterial properties, and Ni allergy resistance; and a method of producing such a silver-white copper alloy. The silver-white copper alloy includes 51.0 mass % to 58.0 mass % of Cu; 9.0 mass % to 12.5 mass % of Ni; 0.0003 mass % to 0.010 mass % of C; 0.0005 mass % to 0.030 mass % of Pb; and the balance of Zn and inevitable impurities, in which a relationship of 65.5≦[Cu]+1.2×[Ni]≦70.0 is satisfied between a content of Cu [Cu] (mass %) and a content of Ni [Ni] (mass %). In a metal structure thereof, an area ratio of β phases dispersed in an α-phase matrix is 0% to 0.9%.
公开/授权文献
信息查询