Invention Grant
- Patent Title: Inductor device, method for manufacturing the same and printed wiring board
- Patent Title (中): 电感器件,制造方法和印刷电路板
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Application No.: US14603822Application Date: 2015-01-23
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Publication No.: US09514876B2Publication Date: 2016-12-06
- Inventor: Yasuhiko Mano , Kazuhiro Yoshikawa , Haruhiko Morita
- Applicant: IBIDEN Co., Ltd.
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2012-143230 20120626
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/29 ; H01F27/28 ; H01F27/24 ; H01F41/04

Abstract:
A printed wiring board includes an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding a circumference of the magnetic core structure. The magnetic core structure and the inductor pattern of the conductor layer form an inductor device.
Public/Granted literature
- US20150137931A1 INDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND PRINTED WIRING BOARD Public/Granted day:2015-05-21
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