Invention Grant
- Patent Title: Multilayer ceramic electronic component
- Patent Title (中): 多层陶瓷电子元件
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Application No.: US13902587Application Date: 2013-05-24
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Publication No.: US09514882B2Publication Date: 2016-12-06
- Inventor: Byung Jun Jeon , Kyu Ha Lee , Hyun Hee Gu , Chang Hoon Kim , Myung Jun Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0018274 20130220
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/005 ; H01G4/12 ; H01G4/012 ; H01G4/232

Abstract:
There is provided a multilayer ceramic electronic component, including: a ceramic body having internal electrodes formed therein; external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes; and buffer layers formed on contact surfaces between the internal electrodes and the external electrodes, among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the internal electrode is denoted by Te, a number of laminated internal electrodes is denoted by N, a thickness of the buffer layer is denoted by t, and a width of a margin of the ceramic body in a length direction of the ceramic body is denoted by L, Te≦0.6 μm, N>200, and 3 μm≦t
Public/Granted literature
- US20140233148A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2014-08-21
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