Invention Grant
- Patent Title: Thin wire/thick wire lead assembly for electrolytic capacitor
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Application No.: US15049612Application Date: 2016-02-22
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Publication No.: US09514891B2Publication Date: 2016-12-06
- Inventor: Lotfi Djebara , Stanislav Zednicek , Ivan Horacek , Jan Petrzilek
- Applicant: AVX Corporation
- Applicant Address: US SC Fountain Inn
- Assignee: AVX Corporation
- Current Assignee: AVX Corporation
- Current Assignee Address: US SC Fountain Inn
- Agency: Dority & Manning, P.A.
- Main IPC: H01G9/012
- IPC: H01G9/012 ; H01G9/052 ; H01G9/00 ; H01G9/15 ; H01G9/025 ; H01G9/042 ; H01G9/07

Abstract:
A capacitor containing a solid electrolytic capacitor element including a sintered porous anode body, a first anode lead, and a second anode lead is provided. The first anode lead has a thickness that is larger than a thickness of the second anode lead. A portion of the first anode lead is embedded in the porous anode body, and a second portion of the first anode lead extends from a surface thereof in a longitudinal direction. Meanwhile, the second anode lead is electrically connected to the anode body for connection to an anode termination. In one embodiment, the second anode lead can be directly connected to a surface of the anode body. In another embodiment, the second anode lead can be indirectly connected to the anode body such as via attachment at an end of the second portion of the first anode lead.
Public/Granted literature
- US20160172116A1 Thin Wire/Thick Wire Lead Assembly for Electrolytic Capacitor Public/Granted day:2016-06-16
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