发明授权
- 专利标题： Corrugated solder pre-form and method of use
- 专利标题（中）： 波纹焊料预制和使用方法
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申请号： US14110538申请日： 2012-02-06
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公开(公告)号： US09515444B2公开(公告)日： 2016-12-06
- 发明人: Kendrick Van Swearingen
- 申请人： Kendrick Van Swearingen
- 申请人地址： US NC Hickory
- 专利权人： CommScope Technologies LLC
- 当前专利权人： CommScope Technologies LLC
- 当前专利权人地址： US NC Hickory
- 代理机构： Myers Bigel, P.A.
- 国际申请： PCT/US2012/024000 WO 20120206
- 国际公布： WO2012/141777 WO 20121018
- 主分类号： B23K35/00
- IPC分类号： B23K35/00 ; B23K35/14 ; H01R43/02 ; H01R9/05 ; B23K35/362 ; B23K1/20 ; B23K35/02 ; B23K1/00
摘要：
A solder pre-form for soldering a coaxial cable to a connector body is provided with a plurality of flux grooves on a cable side and a connector side. The solder pre-form may also have a plurality of holes between the cable and connector sides. In a method of use, flux is applied to the flux grooves and the solder pre-form applied to encircle the outer conductor which is then inserted into the connector body and the solder pre-form melted to complete the solder interconnection. Where holes are present, flux may be applied to the connector side, passing through the holes also to the cable side.
公开/授权文献
- US20140076958A1 Corrugated Solder Pre-form and Method of Use 公开/授权日：2014-03-20
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